Winbond W25Q80DVUXIE
Manufacturer No: W25Q80DVUXIE
Manufacturer: Winbond
Package:
Description: NOR Flash Serial-SPI 3V 8Mbit 1M x 8Bit 5ns 8-Pin USON
Product Attributes Support
- Surface Mount:YES
- Number of Terminals:8
- Package Description:HVSON, SOLCC8,.12,20
- Package Style:SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
- Number of Words Code:8000000
- Package Body Material:PLASTIC/EPOXY
- Package Equivalence Code:SOLCC8,.12,20
- Operating Temperature-Min:-40 °C
- Reflow Temperature-Max (s):NOT SPECIFIED
- Operating Temperature-Max:85 °C
- Rohs Code:Yes
- Manufacturer Part Number:W25Q80DVUXIE
- Clock Frequency-Max (fCLK):104 MHz
- Number of Words:8388608 words
- Supply Voltage-Nom (Vsup):3 V
- Package Code:HVSON
- Package Shape:RECTANGULAR
- Manufacturer:Winbond Electronics Corp
- Part Life Cycle Code:Active
- Ihs Manufacturer:WINBOND ELECTRONICS CORP
- Risk Rank:5.28
- Dimensions:2X3mm2
- Package:USON - 8
- Type:NOR TYPE
- Subcategory:Flash Memories
- Technology:CMOS
- Terminal Position:DUAL
- Terminal Form:NO LEAD
- Peak Reflow Temperature (Cel):NOT SPECIFIED
- Number of Functions:1
- Terminal Pitch:0.5 mm
- Reach Compliance Code:compliant
- Frequency:80MHz
- JESD-30 Code:R-PDSO-N8
- Qualification Status:Not Qualified
- Supply Voltage-Max (Vsup):3.6 V
- Power Supplies:3/3.3 V
- Temperature Grade:INDUSTRIAL
- Supply Voltage-Min (Vsup):2.7 V
- Voltage:2.7 ~ 3.6V
- Operating Mode:SYNCHRONOUS
- Supply Current-Max:0.025 mA
- Organization:8MX1
- Seated Height-Max:0.6 mm
- Memory Width:1
- Density:8Mb
- Standby Current-Max:0.000005 A
- Memory Density:8388608 bit
- Parallel/Serial:SERIAL
- Memory IC Type:FLASH
- Programming Voltage:3 V
- Serial Bus Type:SPI
- Endurance:100000 Write/Erase Cycles
- Data Retention Time-Min:20
- Write Protection:HARDWARE/SOFTWARE
- Temperature:-40~+85˚C
- Width:2 mm
- Length:3 mm
IN STOCK:20000
Increments of:1
-
Subtotal: $ 0.00000
Click To Quote